HDI high-frequency circuit board is a circuit board with a relatively high line distribution density using micro-blind buried hole technology. It is designed for compact electronic products for small-capacity users.
It adopts modular design for parallel connection. The capacity of one module is 1000VA (height 1U). It is naturally cooled and can be directly put into a 19″ rack. It can connect up to 6 modules in parallel.
Using all-digital signal processing (DSP) technology and a number of patented technologies, it has a full range of load capacity and strong short-term overload capability, regardless of the load power factor and crest factor.
HDI printed circuit board is a structural element formed by insulating material supplemented by conductor wiring.
3+N+3 | 2mil precision circuit
Plate material | Copper foil without glass fiber, FR4 |
PCB layers | 11-18 layers |
Board thickness | 2.0±0.15mm |
Minimum aperture | 0.1mm |
Surface treatment | ENIG |
BGA size | 0.25mm |
Surface Finishing | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card |
Minimum line width/distance | 0.13mm/0.15mm |
Blind hole structure | 1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers |
Process characteristics | HDI blind buried hole process, high BGA density, small hole-to-line spacing |
Plate material | Copper foil without glass fiber, FR4 |
PCB layers | 11-18 layers |
Board thickness | 2.0±0.15mm |
Minimum aperture | 0.1mm |
Surface treatment | ENIG |
BGA size | 0.25mm |
Surface Finishing | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card |
Minimum line width/distance | 0.13mm/0.15mm |
Blind hole structure | 1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers |
Process characteristics | HDI blind buried hole process, high BGA density, small hole-to-line spacing |
Plate material | Copper foil without glass fiber, FR4 |
PCB layers | 11-18 layers |
Board thickness | 2.0±0.15mm |
Minimum aperture | 0.1mm |
Surface treatment | ENIG |
BGA size | 0.25mm |
Surface Finishing | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card |
Minimum line width/distance | 0.13mm/0.15mm |
Blind hole structure | 1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers |
Process characteristics | HDI blind buried hole process, high BGA density, small hole-to-line spacing |