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PCB & PCBA one-stop manufacturer
fastpcba
  • +86 75526978877
  • pcba15@fastpcba.cn
  • Mon - Sat : 8:00 - 22:00
HDI PCB

High Density Interconnector

HDI high-frequency circuit board is a circuit board with a relatively high line distribution density using micro-blind buried hole technology. It is designed for compact electronic products for small-capacity users.

It adopts modular design for parallel connection. The capacity of one module is 1000VA (height 1U). It is naturally cooled and can be directly put into a 19″ rack. It can connect up to 6 modules in parallel.

Using all-digital signal processing (DSP) technology and a number of patented technologies, it has a full range of load capacity and strong short-term overload capability, regardless of the load power factor and crest factor.

HDI printed circuit board is a structural element formed by insulating material supplemented by conductor wiring.

3+N+3 | 2mil precision circuit

Sophisticated HDI process

Top technical team, superb HDI process technology

☆ All employees have professional technical personnel with 8-12 years of PCB industry experience, from the technical level to ensure high stability and high reliability of HDI products
☆ High-precision back-drilling technology reduces the equivalent series inductance of vias and meets the integrity requirements of product signal transmission

Leading technology capabilities to meet different board requirements

☆ Maximum thickness to diameter ratio 10:1; maximum copper thickness 6OZ; maximum working board size; 1100x500mm
☆ The thinnest 4-layer board 0.33mm; the smallest mechanical hole/pad 0.2/0.40mm
☆ Drilling accuracy +/-0.05mm; PTH aperture tolerance +/-0.05mm
☆ Minimum line width/line distance 0.075/0.075mm

Advanced production equipment and inspection equipment

☆ Equipped with a complete set of surface treatment production lines for HDI products
☆ Automatic V cutting machine, laser drilling machine, Hitachi mechanical drilling machine, fully automatic exposure machine, LDI, AOI
☆ Complete surface treatment process (Immersion Gold, Immersion Silver, Immersion Tin, OSP, Spray Tin, Gold Plating, Tin Plating, Silver Plating)

9 inspection procedures to ensure 100% quality pass rate

☆ Strictly controlled according to IPC standards, with a pass rate of 100%
☆ Imported German advanced inspection equipment to ensure high reliability and stability of products
☆ Strictly implement quality PDCA process and continuously improve product performance

Implementation of ROSH, green and environmental protection

☆ All products are executed by Rosh
☆ Lead-free solder paste, green and environmental protection
☆ Ultra-clean, dust-free and anti-static workshop, longer product life
☆ All HDI plates are first-line brand products

Unique advantages, many people choose

☆ When the density of PCB exceeds eight layers, it is manufactured with HDI, and the cost is lower
☆ Increase line density ☆ Facilitate the use of advanced construction technology
☆ Has better electrical performance and signal accuracy
☆ Can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)
HDI PCB manufacturing capabilities:
Plate materialCopper foil without glass fiber, FR4
PCB layers11-18 layers
Board thickness2.0±0.15mm 
Minimum aperture0.1mm
Surface treatmentENIG
BGA size0.25mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Minimum line width/distance0.13mm/0.15mm
Blind hole structure1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers
Process characteristics HDI blind buried hole process, high BGA density, small hole-to-line spacing
Plate materialCopper foil without glass fiber, FR4
PCB layers11-18 layers
Board thickness2.0±0.15mm 
Minimum aperture0.1mm
Surface treatmentENIG
BGA size0.25mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Minimum line width/distance0.13mm/0.15mm
Blind hole structure1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers
Process characteristics HDI blind buried hole process, high BGA density, small hole-to-line spacing
Plate materialCopper foil without glass fiber, FR4
PCB layers11-18 layers
Board thickness2.0±0.15mm 
Minimum aperture0.1mm
Surface treatmentENIG
BGA size0.25mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Minimum line width/distance0.13mm/0.15mm
Blind hole structure1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers
Process characteristics HDI blind buried hole process, high BGA density, small hole-to-line spacing
HDI PCB manufacturing capabilities:
Processing flow of double-sided PCB
Processing flow of double-sided PCB
Processing flow of double-sided PCB
PCB security case
PCB security case
PCB automotive electronics
PCB automotive electronics
PCB audio equipment
PCB audio equipment
LED
LED
PCB power supply equipment
PCB power supply equipment
PCB power module
PCB power module
PCB medical electronics
PCB medical electronics
PCB high frequency amplifier
PCB high frequency amplifier
PCB computer electronics
PCB computer electronics
PCB communication electronics
PCB communication electronics

HDI PCB Product Display

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  • Pcba15@fastpcba.cn
  • +86 13422897489
  • Tel：+86 755 26978877
  • Wechat：86 13422897489
  • 3/F. 1/B, 18-2 Yuquan East Rd. Yulv Village. Guangming New district. Shenzhen. China.

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