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HDI PCB

High Density Interconnector

HDI high-frequency circuit board is a circuit board with a relatively high line distribution density using micro-blind buried hole technology. It is designed for compact electronic products for small-capacity users.

It adopts modular design for parallel connection. The capacity of one module is 1000VA (height 1U). It is naturally cooled and can be directly put into a 19″ rack. It can connect up to 6 modules in parallel.

Using all-digital signal processing (DSP) technology and a number of patented technologies, it has a full range of load capacity and strong short-term overload capability, regardless of the load power factor and crest factor.

HDI printed circuit board is a structural element formed by insulating material supplemented by conductor wiring.

3+N+3 | 2mil precision circuit

Sophisticated HDI process

HDI PCB manufacturing capabilities:
Plate materialCopper foil without glass fiber, FR4
PCB layers11-18 layers
Board thickness2.0±0.15mm 
Minimum aperture0.1mm
Surface treatmentENIG
BGA size0.25mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Minimum line width/distance0.13mm/0.15mm
Blind hole structure1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers
Process characteristics HDI blind buried hole process, high BGA density, small hole-to-line spacing
Plate materialCopper foil without glass fiber, FR4
PCB layers11-18 layers
Board thickness2.0±0.15mm 
Minimum aperture0.1mm
Surface treatmentENIG
BGA size0.25mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Minimum line width/distance0.13mm/0.15mm
Blind hole structure1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers
Process characteristics HDI blind buried hole process, high BGA density, small hole-to-line spacing
Plate materialCopper foil without glass fiber, FR4
PCB layers11-18 layers
Board thickness2.0±0.15mm 
Minimum aperture0.1mm
Surface treatmentENIG
BGA size0.25mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Minimum line width/distance0.13mm/0.15mm
Blind hole structure1-2 layers, 2-3 layers, 3-4 layers, 9-10 layers, 10-11 layers, 11-12 layers
Process characteristics HDI blind buried hole process, high BGA density, small hole-to-line spacing
HDI PCB manufacturing capabilities:
Processing flow of double-sided PCB
Processing flow of double-sided PCB
Processing flow of double-sided PCB

Factory video

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