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General introduction of Multilayer PCB
As the name suggests, a multi-layer circuit board can only be called a multi-layer circuit board with more than two layers, such as four layers, six layers, eight layers, and so on. Of course, some designs are three-layer or five-layer circuit, also called multi-layer PCB circuit board.
Conductive wiring diagram larger than the two-layer board. The insulating substrate is separated between the layers. After each layer of the circuit is printed, each layer of the circuit is overlapped by pressing. After drilling, the electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board.
Multi-layer PCB production process
Multi-layer PCB manufacturing capabilities in the table:
| Item | Parameter |
| Layers NO. | ≥26 layers (CS) |
| Thickness | 0.4 ->6.0MM |
| Min. mechanical aperture | 0.1mm |
| Min. laser aperture | 3mil |
| HDI type | Level 2 and above |
| Min.line width / spacing | 3/3mil |
| Impedance control | +/-5% |
| Max.copper thickness | 12oz |
| Max.plate thickness aperture ratio | 18:01 |
| Max.board size | 550*780mm(CS) |
| Substrate | IT158/IT180AFR-4; aluminum base; polytetrafluoroethylene; Rogers4350 + FR-4 mixed pressure (P film is ordinary Shengyi P film and ROGERS 4403); CEM-3 (single and double panel), Lianmao IT158 / IT180A |
| Surface coating | Tin spray (+ gold finger), electroplated nickel / gold, chemical nickel / gold (+ gold finger), OSP (+ gold finger), immersion silver (+ gold finger), immersion tin |
Production cycle：
| Layers No. | Batch (≤500) | Sample (≤1) | Expedited |
| Double-sided | 1-2 days | 12 hours | |
| 4 layer | 8-9 days | 2-3 days | 3-4 days |
| 6 layer | 9-10 days | 3-4 days | 3-4 days |
| 8 layer | 10-12 days | 4-5 days | 3-4 days |
| 10 layer | Two weeks | 5-6 days | 3-4 days |
| 12 layer | 14-16 days | One week | 3-4 days |
| 14 layer | 14-16 days | 7-8 days | 3-4 days |
| 16 layer | 16-18 days | 8-9 days | 3-4 days |
| 18 layer | 18-20 days | 9-10 days | 3-4 days |
| 20 layer | 3 weeks | 10 days | 5-6 days |
| 22 layer | 3 weeks | 10 days | 5-6 days |
| 24 layer | 3 weeks | 10 days | 5-6 days |
| 26 layer | 3 weeks | 10 days | 5-6 days |
| 28 layer | 3 weeks | 10 days | 5-6 days |
| 30 layer | 3 weeks | 10 days | 5-6 days |
| 32 layer | 3 weeks | 10 days | 5-6 days |
Multi-layer PCB manufacturing capabilities in the table:
| Item | Parameter |
| Number of layers | ≥26 layers (CS) |
| Thickness | 0.4 ->6.0MM |
| Minimum mechanical aperture | 0.1mm |
| Minimum laser aperture | 3mil |
| HDI type | Level 2 and above |
| Minimum line width & spacing | 3/3mil |
| Impedance control | +/-5% |
| Maximum copper thickness | 12oz |
| Maximum plate thickness aperture ratio | 18:01 |
| Maximum board size | 550*780mm(CS) |
| Substrate | IT158/IT180AFR-4; aluminum base; polytetrafluoroethylene; Rogers4350 + FR-4 mixed pressure (P film is ordinary Shengyi P film and ROGERS 4403); CEM-3 (single and double panel), Lianmao IT158 / IT180A |
| Surface coating | Tin spray (+ gold finger), electroplated nickel / gold, chemical nickel / gold (+ gold finger), OSP (+ gold finger), immersion silver (+ gold finger), immersion tin |
Production cycle：
Layers No. | Batch (≤500) | Sample (≤1) | Expedited order |
| Double-sided | 1-2 days | 12 hours | |
| 4 layer | 8-9 days | 2-3 days | 3-4 days |
| 6 layer | 9-10 days | 3-4 days | 3-4 days |
| 8 layer | 10-12 days | 4-5 days | 3-4 days |
| 10 layer | Two weeks | 5-6 days | 3-4 days |
| 12 layer | 14-16 days | One week | 3-4 days |
| 14 layer | 14-16 days | 7-8 days | 3-4 days |
| 16 layer | 16-18 days | 8-9 days | 3-4 days |
| 18 layer | 18-20 days | 9-10 days | 3-4 days |
| 20 layer | 3 weeks | 10 days | 5-6 days |
| 22 layer | 3 weeks | 10 days | 5-6 days |
| 24 layer | 3 weeks | 10 days | 5-6 days |
| 26 layer | 3 weeks | 10 days | 5-6 days |
| 28 layer | 3 weeks | 10 days | 5-6 days |
| 30 layer | 3 weeks | 10 days | 5-6 days |
| 32 layer | 3 weeks | 10 days | 5-6 days |
Multi-layer PCB manufacturing capabilities in the table:
| Item | Parameter |
| Number of layers | ≥26 layers (CS) |
| Thickness | 0.4 ->6.0MM |
| Minimum mechanical aperture | 0.1mm |
| Minimum laser aperture | 3mil |
| HDI type | Level 2 and above |
| Minimum line width & spacing | 3/3mil |
| Impedance control | +/-5% |
| Maximum copper thickness | 12oz |
| Maximum plate thickness aperture ratio | 18:01 |
| Maximum board size | 550*780mm(CS) |
| Substrate | IT158/IT180AFR-4; aluminum base; polytetrafluoroethylene; Rogers4350 + FR-4 mixed pressure (P film is ordinary Shengyi P film and ROGERS 4403); CEM-3 (single and double panel), Lianmao IT158 / IT180A |
| Surface coating | Tin spray (+ gold finger), electroplated nickel / gold, chemical nickel / gold (+ gold finger), OSP (+ gold finger), immersion silver (+ gold finger), immersion tin |
Production cycle：
| Layers No. | Batch (≤500) | Sample (≤1) | Expedited order |
| Double-sided | 1-2 days | 12 hours | |
| 4 layer | 8-9 days | 2-3 days | 3-4 days |
| 6 layer | 9-10 days | 3-4 days | 3-4 days |
| 8 layer | 10-12 days | 4-5 days | 3-4 days |
| 10 layer | Two weeks | 5-6 days | 3-4 days |
| 12 layer | 14-16 days | One week | 3-4 days |
| 14 layer | 14-16 days | 7-8 days | 3-4 days |
| 16 layer | 16-18 days | 8-9 days | 3-4 days |
| 18 layer | 18-20 days | 9-10 days | 3-4 days |
| 20 layer | 3 weeks | 10 days | 5-6 days |
| 22 layer | 3 weeks | 10 days | 5-6 days |
| 24 layer | 3 weeks | 10 days | 5-6 days |
| 26 layer | 3 weeks | 10 days | 5-6 days |
| 28 layer | 3 weeks | 10 days | 5-6 days |
| 30 layer | 3 weeks | 10 days | 5-6 days |
| 32 layer | 3 weeks | 10 days | 5-6 days |
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