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General introduction of Multilayer PCB

As the name suggests, a multi-layer circuit board can only be called a multi-layer circuit board with more than two layers, such as four layers, six layers, eight layers, and so on. Of course, some designs are three-layer or five-layer circuit, also called multi-layer PCB circuit board.

Conductive wiring diagram larger than the two-layer board. The insulating substrate is separated between the layers. After each layer of the circuit is printed, each layer of the circuit is overlapped by pressing. After drilling, the electrical connection between them is usually achieved through plated through holes on the cross section of the circuit board.

multilayer-pcb-layer-stackup

multilayer-pcb-layer-stackup

Multi-layer PCB production process

Multilayer board production process

Multi-layer PCB manufacturing capabilities in the table: 

ItemParameter
Layers NO.≥26 layers (CS)
Thickness0.4 ->6.0MM
Min. mechanical aperture0.1mm
Min. laser aperture3mil
HDI typeLevel 2 and above
Min.line width / spacing3/3mil
Impedance control+/-5%
Max.copper thickness12oz
Max.plate thickness aperture ratio18:01
Max.board size550*780mm(CS)
SubstrateIT158/IT180AFR-4; aluminum base; polytetrafluoroethylene; Rogers4350 + FR-4 mixed pressure (P film is ordinary Shengyi P film and ROGERS 4403); CEM-3 (single and double panel), Lianmao IT158 / IT180A
Surface coatingTin spray (+ gold finger), electroplated nickel / gold, chemical nickel / gold (+ gold finger), OSP (+ gold finger), immersion silver (+ gold finger), immersion tin

Production cycle:

Layers No.Batch (≤500)Sample (≤1)Expedited
Double-sided 1-2 days12 hours
4 layer8-9 days2-3 days3-4 days
6 layer9-10 days3-4 days3-4 days
8 layer10-12 days4-5 days3-4 days
10 layerTwo weeks5-6 days3-4 days
12 layer14-16 daysOne week3-4 days
14 layer14-16 days7-8 days3-4 days
16 layer16-18 days8-9 days3-4 days
18 layer18-20 days9-10 days3-4 days
20 layer3 weeks10 days5-6 days
22 layer3 weeks10 days5-6 days
24 layer3 weeks10 days5-6 days
26 layer3 weeks10 days5-6 days
28 layer3 weeks10 days5-6 days
30 layer3 weeks10 days5-6 days
32 layer3 weeks10 days5-6 days

Multi-layer PCB manufacturing capabilities in the table:

ItemParameter
Number of layers≥26 layers (CS)
Thickness0.4 ->6.0MM
Minimum mechanical aperture0.1mm
Minimum laser aperture3mil
HDI typeLevel 2 and above
Minimum line width & spacing3/3mil
Impedance control+/-5%
Maximum copper thickness12oz
Maximum plate thickness aperture ratio18:01
Maximum board size550*780mm(CS)
SubstrateIT158/IT180AFR-4; aluminum base; polytetrafluoroethylene; Rogers4350 + FR-4 mixed pressure (P film is ordinary Shengyi P film and ROGERS 4403); CEM-3 (single and double panel), Lianmao IT158 / IT180A
Surface coatingTin spray (+ gold finger), electroplated nickel / gold, chemical nickel / gold (+ gold finger), OSP (+ gold finger), immersion silver (+ gold finger), immersion tin

Production cycle:

Layers No.

Batch (≤500)Sample (≤1)Expedited order
Double-sided 1-2 days12 hours
4 layer8-9 days2-3 days3-4 days
6 layer9-10 days3-4 days3-4 days
8 layer10-12 days4-5 days3-4 days
10 layerTwo weeks5-6 days3-4 days
12 layer14-16 daysOne week3-4 days
14 layer14-16 days7-8 days3-4 days
16 layer16-18 days8-9 days3-4 days
18 layer18-20 days9-10 days3-4 days
20 layer3 weeks10 days5-6 days
22 layer3 weeks10 days5-6 days
24 layer3 weeks10 days5-6 days
26 layer3 weeks10 days5-6 days
28 layer3 weeks10 days5-6 days
30 layer3 weeks10 days5-6 days
32 layer3 weeks10 days5-6 days

Multi-layer PCB manufacturing capabilities in the table:

ItemParameter
Number of layers≥26 layers (CS)
Thickness0.4 ->6.0MM
Minimum mechanical aperture0.1mm
Minimum laser aperture3mil
HDI typeLevel 2 and above
Minimum line width & spacing3/3mil
Impedance control+/-5%
Maximum copper thickness12oz
Maximum plate thickness aperture ratio18:01
Maximum board size550*780mm(CS)
SubstrateIT158/IT180AFR-4; aluminum base; polytetrafluoroethylene; Rogers4350 + FR-4 mixed pressure (P film is ordinary Shengyi P film and ROGERS 4403); CEM-3 (single and double panel), Lianmao IT158 / IT180A
Surface coatingTin spray (+ gold finger), electroplated nickel / gold, chemical nickel / gold (+ gold finger), OSP (+ gold finger), immersion silver (+ gold finger), immersion tin

Production cycle:

Layers No.Batch (≤500)Sample (≤1)Expedited order
Double-sided 1-2 days12 hours
4 layer8-9 days2-3 days3-4 days
6 layer9-10 days3-4 days3-4 days
8 layer10-12 days4-5 days3-4 days
10 layerTwo weeks5-6 days3-4 days
12 layer14-16 daysOne week3-4 days
14 layer14-16 days7-8 days3-4 days
16 layer16-18 days8-9 days3-4 days
18 layer18-20 days9-10 days3-4 days
20 layer3 weeks10 days5-6 days
22 layer3 weeks10 days5-6 days
24 layer3 weeks10 days5-6 days
26 layer3 weeks10 days5-6 days
28 layer3 weeks10 days5-6 days
30 layer3 weeks10 days5-6 days
32 layer3 weeks10 days5-6 days

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