1 |
Plate Type |
Aluminum substrate (AL) / copper substrate (Cu) / iron substrate (Fe) |
2 |
Surface Treatment |
(chemical Au)/ Spray tin(Sn)/ silvering(Ag)/ Electroless(Au)/ OSP
|
3 |
Layers |
1-32 |
4 |
Max.Board Size |
585mm x 1185mm |
5 |
Min.Board Size |
3mm x 10mm |
6 |
Board Thickness |
0.4mm - 6.0mm |
7 |
Copper Thickness |
0.5 oz / 10 oz / 2 oz / 3 oz / 4 oz |
8 |
Min.Line Width |
0.127mm |
9 |
Min.Space |
0.127mm |
10 |
Min.Hole Size |
0.5mm |
11 |
PTH Wall Thickness |
>0.025mm |
12 |
PTH Hole Dia.Tolerance |
±0.075mm(GB/T 1804-f) |
13 |
Non PTH Hole Dia.Tolerance |
±0.05mm(GB/T 1804-f) |
14 |
Hole Position Deviation |
±0.10mm(GB/T 1804-f) |
15 |
Outline Tolerance |
±0.10mm(GB/T 1804-f) |
16 |
V-cut |
30°/40°/60° |
17 |
V-cut Size |
5mm x 1200mm |
18 |
V-cut Board Thickness |
0.6mm - 3mm |
19 |
V-cut verticality |
≤0.15mm |
20 |
Min.BGA PAD |
0.35mm |
21 |
Soldemask Layer Min.Bridge width |
0.127mm |
22 |
Soldemask film Min.Thickness |
0.254mm |
23 |
Insulation Resistance |
10 to the 12th powerΩNormal |
24 |
Peel-off Strength |
2.2N/mm |
25 |
Solder Float |
260℃ 3min |
26 |
E-test Voltage |
50-250V |
27 |
Thermal Conductivity |
0.8-8W / M.K |
28 |
Warp or twist |
≤0.5% |
29 |
Flammability |
FV-0 |