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What is a double-sided PCB

The double-sided PCB is a common type of printed circuit board. It has wires and components on both the front and back sides, and the double-sided PCB boards are connected with vias in the middle. The double-sided printed circuit board has two upper and lower conductor patterns, and the upper and lower via holes are connected by expensive perforations. In the processing of printed circuit boards, the hole walls of your perforated holes are coated with a copper layer to make the upper and lower layers conductive. Double-sided printed circuit boards are usually double-sided copper-clad laminates, using screen printing or photo imaging. A resist pattern is formed on the copper surface, and excess copper foil is removed by chemical etching to form a conductor pattern.

double-sided PCB

Steps to draw double-layer PCB board

1. Prepare the circuit schematic
2. Create a new PCB file and load it into the component package library
3. Planning the circuit board
4. Load the netlist and components
5. Automatic layout of components
6. Layout adjustment
7. Network density analysis
8. Wiring rule setting
9. Automatic wiring
10. Manually adjust the wiring
After the components of the double-layer PCB are drawn in the EDA software, the wiring sequence is first designed as power line, sensitive line, high frequency line and low frequency line. It is best to have a separate power supply for the key lead, a ground return, and the lead is very short, so sometimes a ground wire is placed close to the signal line on the edge of the key lead to make it form the smallest working loop.

The signal lines of the double-layer PCB board are the key crystal, crystal oscillator circuit, clock circuit, CPU and other signal lines, which must comply with the principle that the circulating area is as small as possible.

Check FASTPCBA Aluminum PCB manufacturing capabilities in the following table:
MaterialAluminum core (Domestic 1060), Copper core, FR4 covering
Thermal conductivity1.0W/(m*k),2.0W/(m*k)
Min. Track/Spacing2mil
Min. Hole Size0.2mm
Base Material94HB-94VO-22F-CEM-1-CEM-3-FR-4
Board Thickness0.6-3.0mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Finsih Cooper1-3oz
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
SilkscreenWhite, Black
Via ProcessTenting Vias,Plugged Vias,Vias not covered
TestingFly Probe Testing (Free) and AOI testing & X-ray  testing
Build time1-3 days
lead time1-5 days
MaterialAluminum core (Domestic 1060), Copper core, FR4 covering
Thermal conductivity1.0W/(m*k),2.0W/(m*k)
Min. Track/Spacing2mil
Min. Hole Size0.2mm
Base Material94HB-94VO-22F-CEM-1-CEM-3-FR-4
Board Thickness0.6-3.0mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Finsih Cooper1-3oz
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
SilkscreenWhite, Black
Via ProcessTenting Vias,Plugged Vias,Vias not covered
TestingFly Probe Testing (Free) and AOI testing & X-ray  testing
Build time1-4 days
lead time3-5 days
MaterialAluminum core (Domestic 1060), Copper core, FR4 covering
Thermal conductivity1.0W/(m*k),2.0W/(m*k)
Min. Track/Spacing2mil
Min. Hole Size0.2mm
Base Material94HB-94VO-22F-CEM-1-CEM-3-FR-4
Board Thickness0.2-3.0mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Finsih Cooper1-3oz
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
SilkscreenWhite, Black
Via ProcessTenting Vias,Plugged Vias,Vias not covered
TestingFly Probe Testing (Free) and AOI testing & X-ray  testing
Build time3-4 days
lead time3-5days

Processing flow of double-sided PCB

Processing flow of double-sided PCB

Factory video

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