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16 Multilayer Ceramic Electronic Circuit Board Assembly PCBA Factory

Additional information

Weight 23 kg
Dimensions 522 × 298 × 36 mm
Min. Line Width:

0.07mm

Processing Technology:

Electrolytic Foil

Insulation Materials:

Organic Resin

Surface Finishing:

HASL, Enig, OSP, Immersion Au, AG, Sn

Min.Hole Size:

0.12mm

Min.Line Spacing:

3.5 Mil

PCBA QC:

X-ray, Aoi Test, Function Test(100% Test)

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Description

16 Multilayer Ceramic Electronic Circuit Board Assembly PCBA Factory

Items  Normal standard  Ultimate
 Material  FR-4;High TG FR-4;CEM-3;CEM-4  Al-base
 Layer NO.  1-20  40
 Board Size  50mm*50mm-560mm*640mm  35mm*50mm
 Board Thickness  0.4mm-4.0mm  0.3mm-6.0mm
 Thickness Tolerance  ±10%  ±7%
 Min Hole Size  0.2mm  0.15mm
 Copper Thickness  18um-105um  18um-420um
 Copper Plating hole  18um-30um  18um-40um
 Min Trace Width  0.1mm  0.75mm
 Min Space Width  0.1mm  0.75mm
 SMD Pitch  0.4mm  0.4mm
 BGA Pitch  0.6mm  0.6mm
 Min Annular Ring  0.07mm  0.05mm
 Register Tolerance  0.05mm  0.025mm
 Solder Mask Color  green;blue;black;red  white; yellow
 Peelable Mask  0.3mm  0.5mm
 HASL  Thickness  2.5um
 lead Free HASL  2.5um
 Immersion Gold  Nickel:47um Au:0.05um  Nickel:7um Au:0.2um
 OSP  Thickness  0.2-2.5um
 Outline Tolerance  CNC:±0.1mm; V-CUT:±0.1mm; Punching:±0.15mm
 Impedance Control  ±10%  ±7%
 Warpage  Less than 1%  Less than 0.7%
 certificate  ISO9001;TS16949

jingbang Business scope mainly include PCB manufacturing, PCB assembly ,ODM ,OEM ;The design and manufacture of stencils and fixture. And other services on the PCB.To provide customers with a one-stop solution from consulting, design, manufacturing, PCBA,to the assembly.
The basic concept of our business is “Honesty service”and “Long-term development”.Pay attention to establish long-term and close cooperation with the customers and suppliers.
We firmly believe that customer growth is the premise and basis of our growth.Our growth will also provideSupport and power for the growth of customers.

Additional information

Weight 23 kg
Dimensions 522 × 298 × 36 mm
Min. Line Width:

0.07mm

Processing Technology:

Electrolytic Foil

Insulation Materials:

Organic Resin

Surface Finishing:

HASL, Enig, OSP, Immersion Au, AG, Sn

Min.Hole Size:

0.12mm

Min.Line Spacing:

3.5 Mil

PCBA QC:

X-ray, Aoi Test, Function Test(100% Test)

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