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Single-sided PCB circuit board

Single-sided PCB circuit board is a kind of printed circuit board. Only one side of the PCB board has circuits (either holes or holes), and the other side is covered with substrate or direct insulating ink, without any circuits and placed under strong light. The whole board is transparent (except for specific requirements of individual boards and processes) ). On the cross-section, only the side with the trace contains copper foil.

What is a single-sided PCB

Types of materials used for single-sided PCB circuit boards

(1) Phenolic paper substrate
Phenolic paper substrate (commonly known as, cardboard, rubber sheet, V0 board, flame retardant board, red copper clad laminate, 94V0. The most commonly used product models of phenolic paper-based copper clad laminate are FR-1 (flame retardant type) and XPC (non-flame retardant Type) Two types. Single-sided copper clad laminates can be easily judged from the color of the characters on the back of the sheet. Generally, the red letters are FR-1 (flame retardant type) and the blue letters are XPC (non-flame retardant type). This type of plate is relative to other types of plates. cheapest.
(2) Epoxy glass fiber cloth substrate
Epoxy glass fiber cloth substrate (commonly known as: epoxy board, glass fiber board, fiber board, FR4), epoxy glass fiber cloth substrate is a type of epoxy resin as an adhesive, and electronic grade glass fiber cloth as a type of reinforcing material Substrate. Its bonding sheet and inner core thin copper clad laminate are important base materials for making multilayer printed circuit boards. The working temperature is higher, and its performance is less affected by the environment. In processing technology, it has great advantages over other resin glass fiber cloth substrates. This type of product is mainly used for double-sided PCBs, which is also about twice as expensive as phenolic paper substrates, with a common thickness of 1.5MM.
(3) Composite substrate
Composite substrate (commonly known as: powder board, etc., cem-1 sheet is also called 22F in some places in China) It mainly refers to CEM-1 and CEM-3 composite base copper clad laminate. Wood pulp fiber paper or cotton pulp fiber paper is used as the core material reinforcement material, and glass fiber cloth is used as the surface reinforcement material. Both are impregnated with copper clad laminate made of flame retardant epoxy resin, called CEM-1. The glass-clad paper is used as the core material reinforcement material, and the glass fiber cloth is used as the surface reinforcement material, which are all impregnated with flame-retardant epoxy resin. These two types of copper clad laminates are the most common composite base copper clad laminates. This type of sheet is cheaper than FR4 type sheet.

Single-sided pcb manufacturing capabilities in the following table:
MaterialSingle-sided PCB circuit boards
Thermal conductivity1.0W/(m*k),2.0W/(m*k)
Min. Track/Spacing2mil
Min. Hole Size0.2mm
Base Materialsingle-sided PCB circuit boards, FR4, Flex, Flex-rigid, HDI, Rogers, etc.
Board Thickness0.2-6.0mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Finsih Cooper1-2oz
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
SilkscreenWhite, Black,red
Via ProcessTenting Vias,Plugged Vias,Vias not covered
TestingFly Probe Testing (Free) and AOI testing & X-ray  testing
Build time1-3 days
lead time1-5 days
MaterialCEM-1, CEM-3 FR4, high TG material
Thermal conductivity1.0W/(m*k),2.0W/(m*k)
Min. Track/Spacing2mil
Min. Hole Size0.2mm
Base MaterialComposite substrate, FR4, Flex, Flex-rigid, HDI, Rogers, etc.
Board Thickness0.2-6.0mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Finsih Cooper1-2oz
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
SilkscreenWhite, Black
Via ProcessTenting Vias,Plugged Vias,Vias not covered
TestingFly Probe Testing (Free) and AOI testing & X-ray  testing
Build time1-3 days
lead time1-5 days
MaterialCEM-1, CEM-3 FR4, high TG material
Thermal conductivity1.0W/(m*k),2.0W/(m*k)
Min. Track/Spacing2mil
Min. Hole Size0.2mm
Base MaterialComposite substrate, FR4, Flex, Flex-rigid, HDI, Rogers, etc.
Board Thickness0.2-3.0mm
Surface FinishingHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card
Finsih Cooper1-2oz
Solder MaskGreen, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
SilkscreenWhite, Black
Via ProcessTenting Vias,Plugged Vias,Vias not covered
TestingFly Probe Testing (Free) and AOI testing & X-ray  testing
Build time1-3 days
lead time1-5 days

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