What are the classifications of flexible multilayer PCBA?
Flexible multi-layer PCB, like rigid multi-layer PCB, adopts multi-layer lamination technology to make multi-layer flexible PCB. The simplest multilayer flexible PCB is a three-layer flexible PCB formed by covering two copper shielding layers on both sides of a single-sided PCB. This three-layer flexible PCB is equivalent to a coaxial wire or a shielded wire in electrical characteristics. The most commonly used multilayer flexible PCB structure is a four-layer structure, which uses metallized holes to realize interlayer interconnection. The middle two layers are generally the power layer and the ground layer.
The advantage of multilayer flexible PCB is that the base film is light in weight and has excellent electrical properties, such as low dielectric constant. The multi-layer flexible PCB board made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multi-layer PCB board, but it loses the excellent single-sided and double-sided flexible PCB. Most of these products do not require flexibility.
Multilayer flexible PCB can be further divided into the following types:
1) A multilayer PCB is formed on a flexible insulating substrate
The finished product is stipulated to be flexible: this structure usually bonds the two sides of many single-sided or double-sided microstrip flexible PCBs together, but the central part is not bonded together, thus having a high degree of flexibility. Sex. In order to have the desired electrical characteristics, such as the characteristic impedance performance and the rigid PCB to which it is interconnected, each circuit layer of the multilayer flexible PCB component must be designed with signal lines on the ground plane. In order to have a high degree of flexibility, a thin, suitable coating, such as polyimide, can be used on the wire layer instead of a thicker laminated cover layer. The metallized holes enable the z-planes between the flexible circuit layers to achieve the required interconnection. This multilayer flexible PCB is most suitable for designs that require flexibility, high reliability, and high density.
2) Construct a multilayer PCB on a flexible insulating substrate
The finished product is not specified to be flexible: this type of multilayer flexible PCB is made of flexible insulating materials, such as polyimide film, laminated to make a multilayer board. The inherent flexibility is lost after lamination. This type of flexible PCB is used when the design requires maximum use of the insulating properties of the film, such as low dielectric constant, uniform thickness of the medium, lighter weight, and continuous processing. For example, a multilayer PCB made of polyimide film insulating material is about one-third lighter than a rigid PCB with epoxy glass cloth.
3) Construct a multilayer PCB on a flexible insulating substrate
The finished product must be formable, not continuously flexible: this type of multilayer flexible PCB is made of soft insulating materials. Although it is made of soft materials, it is limited by electrical design. For example, for the required conductor resistance, a thicker conductor is required, or for the required impedance or capacitance, a thicker conductor is required between the signal layer and the ground layer. The insulation is isolated, so it is already formed in the finished application. The term “formable” is defined as: a multilayer flexible PCB component has the ability to be shaped into the required shape and cannot be flexed in the application. Used in the internal wiring of avionics units. At this time, it is required that the conductor resistance of the strip line or three-dimensional space design is low, the capacitive coupling or circuit noise is extremely small, and the interconnection end can be smoothly bent to 90°. Multi-layer flexible PCB made of polyimide film material achieves this wiring task. Because the polyimide film is resistant to high temperatures, flexible, and has good overall electrical and mechanical properties. In order to achieve all the interconnections of this component section, the wiring part can be further divided into a plurality of multilayer flexible circuit components, which are combined with adhesive tape to form a printed circuit bundle.